DRAM IC
DRAM IC (Dynamic Random Access Memory) are fundamental components of modern electronics, serving as volatile working memory in a wide range of applications – from industrial systems and embedded devices to mobile electronics. Thanks to their high memory density, fast access times, and continuous innovation, they offer an optimal balance of performance, energy efficiency, and reliability.
As an authorized distributor, SYSTEM-D offers a wide selection of DRAM components from leading manufacturers. Our portfolio includes various types of DRAM – from classic SDRAMs and multiple DDR generations to energy-efficient LPDDR variants – available in a range of capacities, package types, and temperature grades. This ensures you’ll find the right memory solution for your specific requirements.
Explore our range of DRAM IC and benefit from our technical expertise and personalized support.
- Capacity: from 64Mb to 16Gb
- On-chip ECC: available for SDRAM, DDR, DDR2, DDR3, and LPDDR4
- AEC-Q100 qualified DRAM ICs
- Operating temperature: 0˚C to +95˚C and -40˚C to +95˚C
- Data transfer rates: 166MHz to 3200MHz
- Warranty: 12 months to 5 years
IM1232SDBABG-75
- SDRAM
- FBGA
- 128Mb
- 133MHz
IM1G08D2DDBG-25
- DDR2
- 1Gb
- 0°C +95°C
- FBGA-60
IM1G08D2DDBG-25I
- DDR2
- 1Gb
- -40°C +95°C
- FBGA-60
IM1G08D3FFBG-107
- DDR3
- 1Gb
- 0°C +95°C
- FBGA-78
IM1G08D3FFBG-107I
- DDR3
- 1Gb
- -40°C +95°C
- FBGA-78
IM1G16D2DDBG-18
- DDR2
- 1Gb
- 0°C +95°C
- FBGA-84
IM1G16D2DDBG-18I
- DDR2
- 1Gb
- -40°C +95°C
- FBGA-84
High-capacity DRAM-IC
Due to the constant demand for higher memory capacity in computer systems, there is a continuos effort in developing techniques to increase the memory density and capacity of DRAM components while maintaining reliable and efficient operation. New cell designs, process technologies and three-dimensional (3D) stacking approaches allow more memory cells to be accommodated on a given surface.
Optimized performance and latency
DRAM performance is a critical factor in determining overall system performance. Research focuses on optimising the performance and reducing the access latency of DRAM ICs. Various aspects such as the management of line buffers, algorithms for command scheduling, techniques for prefetching data and optimisation of memory controllers are being investigated. The aim is to minimise latency, improve bandwidth and increase overall system performance.
Low Power Consumption
Power consumption is an important topic for DRAM ICs, especially for portable devices and systems with energy constraints. High performance efficiency and optimised energy consumption are required here. Power-saving design techniques, power management strategies, adaptive voltage scaling and power-saving access as well as refresh scheduling algorithms can significantly reduce power consumption despite high performance.
